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#: 3M; 3M (TC); 4D Systems Pty Ltd; 頂部

A: Aavid Thermalloy; Abracon LLC; ACL Staticide Inc; Acme Electric/Amveco/Actown; Active-Semi International Inc.; Adafruit Industries LLC; Adapteva Inc.; Adesto Technologies; Advanced Linear Devices Inc.; Advanced Thermal Solutions Inc.; Advantech Corp; Aearo Technologies, LLC; Aeroflex Metelics, Division of MACOM; AKM Semiconductor Inc.; Akros Silicon; Alcatel Components; All Sensors Corporation; Allegro MicroSystems, LLC; Alliance Memory, Inc.; Alliance Sensors Group; Alpha & Omega Semiconductor Inc.; Alpha Wire; Altera; Ambiq Micro, Inc.; American Electrical Inc.; American P.C.B Company; American Technical Ceramics; Ametherm; Amgis, LLC; Amphenol Advanced Sensors; Amphenol Aerospace Operations; Amphenol Anytek; Amphenol Commercial Products; Amphenol FCI; Amphenol Industrial Operations; Amphenol LTW; Amphenol PCD; Amphenol RF Division; Amphenol Sine Systems Corp; Amphenol Spectra-Strip; Amphenol SV Microwave; Amphenol-Tuchel Electronics; Ampleon USA Inc.; Amprobe; ams; Amulet Technologies LLC; Analog Devices Inc.; Anaren; AnDAPT, Inc.; Antenova; Apacer Memory America; APEM Inc.; Apex Microtechnology; Apex Tool Group; API Delevan Inc.; API Technologies Corp; APM Hexseal; Aptina-ON Semiconductor; Arduino; Aries Electronics; ARM; Artaflex Inc.; Artesyn Embedded Technologies; Assmann WSW Components; Astro Tool Corp; ATOP Technologies; ATP Electronics, Inc.; Aven Tools; Avery Dennison RFID; AVX Corp/Kyocera Corp; AVX Corporation; Azoteq (Pty) Ltd; 頂部

B: B B Battery; B&B SmartWorx, Inc.; B&F Fastener Supply; B&K Precision; BEI Sensors; Bel Fuse Inc.; Bel Inc.; Bel Power Solutions; Belden Inc.; Bergquist; Bivar Inc.; BlueCreation; Bluetechnix GmbH; BNS Solutions; Bopla Enclosures; Bosch Sensortec; Bourns Inc.; Bridgelux; Broadcom Limited; Bud Industries; Bulgin; 頂部

C: C&K; Caddock Electronics Inc.; Cal Test Electronics; Calmark/Birtcher; Cantherm; Capital Advanced Technologies; Carclo Technical Plastics; Cardinal Components Inc.; Carling Technologies; CBM America Corporation; CEL; Central Semiconductor Corp; CH Products; Chemtronics; Cherry Americas LLC; Chip Quik Inc.; Cicoil; Cinch Connectivity Solutions; Cinch Connectivity Solutions AIM-Cambridge; Cinch Connectivity Solutions Johnson; Cinch Connectivity Solutions Midwest Microwave; Cinch Connectivity Solutions Semflex; Cinch Connectivity Solutions Trompeter; Cinch Connectivity Solutions Vitelec; Circuitco Electronics LLC; Cirrus Logic Inc.; Citizen; Citizen Finedevice Co Ltd; CNC Tech; Cogent Computer Systems; Comair Rotron; Comchip Technology; Comus International; Conec; ConnectBlue; Connor-Winfield; Conxall/Switchcraft; Copal Electronics Inc.; Copeland Communications Inc.; Cornell Dubilier Electronics (CDE); Cosel USA, Inc.; Coto Technology; CR Magnetics Inc.; Cramer Co.; Cree Inc.; Cree/Wolfspeed; Critical Link LLC; Crouzet; Crydom Co.; Crystek Corporation; C-TON Industries; CTS Electrocomponents; CTS Resistor Products; CTS Thermal Management Products; CTS-Frequency Controls; CUI Inc.; Curtis Industries; Curtis Instruments Inc.; Custom Computer Services Inc. (CCS); CW Industries; Cymbet Corporation; Cynergy 3; Cypress Semiconductor Corp; 頂部

D: Daburn Electronics; Datak; Dave Embedded Systems; Davies Molding, LLC; Decawave Limited; Delta Electronics; Desco; DFRobot; Dialight; Dialog Semiconductor GmbH; Digi International; Digi-Key Electronics; Digi-Key Evaluation Boards; Digi-Key Kit; Digi-Key/Cree; Digilent, Inc.; Digital Six Labs; Digital View Inc.; Diodes Incorporated; Displaytech; DLP Design Inc.; Dresden Elektronik; Dynastream Innovations Inc.; 頂部

E: E Ink Corporation; Easy Braid Co.; Eaton; ebm-papst Inc.; Echelon Corporation; Econais; ECS Inc.; EDAC Inc.; Electric Imp Inc.; Electronic Assembly GmbH; Electroswitch; Elna America; Embedded Artists; Energizer Battery Company; EnerSys; Enfis; enmo Technologies; Enocean; Enpirion; EPC; EPCOS (TDK); EPSON; Epson Electronics America Inc-Semiconductor Div; Equinox Technologies; ERP Power, LLC; Essentra Components; E-Switch; E-T-A; Ethertronics Inc.; Everlight Electronics Co Ltd; Everspin Technologies Inc.; Exar Corporation; Excelitas Technologies; Excelsys Technologies Ltd; E-Z-Hook; 頂部

F: Fairchild/Micross Components; Fairchild/ON Semiconductor; FDK America, Inc., a member of Fujitsu Group; Fedco Batteries; FEIG Electronic; Ferroxcube; Finisar Corporation; Flambeau Inc.; Flexipanel; FLIR; Formerica Optoelectronics Inc.; Fox Electronics; Foxconn Optical Interconnect Technologies, Inc.; Free2Move; Fremont Micro Devices USA; FTDI, Future Technology Devices International Ltd; Fujitsu Electronics America, Inc.; Future Designs Inc.; 頂部

G: GainSpan Corporation; GC Electronics; GE Critical Power; Gems Sensors Inc; General Cable/Carol Brand; GeneSiC Semiconductor; GHI Electronics, LLC; Glenair; Global Power Technologies Group; Global Specialties; Grayhill Inc.; Greenlee Communications; 頂部

H: H&D Wireless AB; Hammond Manufacturing; HARTING; Harwin Inc.; Heatron Inc.; HellermannTyton; Heraeus Sensor Technology USA; Hirose Electric Co Ltd; Hirschmann; Hoei America Inc.; Hoffman Enclosures, Inc.; Holmate Technology Corp. (Holtek); Holt Integrated Circuits Inc.; Honeywell Microelectronics & Precision Sensors; Honeywell Sensing and Control EMEA; Honeywell Sensing and Productivity Solutions; Honeywell Sensing and Productivity Solutions T&M; 頂部

I: I.O. Interconnect; IAR Systems Software Inc.; Icon; IDT, Integrated Device Technology Inc; Illinois Capacitor; Illumra; Industrial Fiberoptics; Infineon Technologies; Infineon Technologies Industrial Power and Controls Americas; Initial State Technologies, Inc.; Injectorall Electronics; Inolux; Inphi Corporation; Inspired LED, LLC; Intel; Intematix Corporation; Interlink Electronics; Intersil; Inventek Systems; Inventus Power; IPDiA; IRTouch Systems; Isocom Components 2004 LTD; ISSI, Integrated Silicon Solution Inc; ITT Cannon, LLC; IXYS; IXYS Integrated Circuits Division; 頂部

J: JAE Electronics; Jaro Components Inc.; Jewell Instruments LLC; Jinlong Machinery & Electronics, Inc.; JKL Components Corp.; Johanson Dielectrics Inc.; Johanson Technology Inc.; Jonard Tools; JST Sales America Inc.; Judco Manufacturing Inc.; 頂部

K: KEMET; Kennedy Labs, a division of Hub Incorporated; Kester Solder; Keystone Electronics; Khatod North America LLC; Kilo International; Kingbright; Kionix Inc.; Klein Tools, Inc.; Knowles; Knowles Dielectric Labs; Knowles Novacap; Knowles Syfer; Knowles Voltronics; KSM Electronics Inc.; Kyocera International, Inc.; 頂部

L: Laird - Embedded Wireless Solutions; Laird Technologies - Engineered Thermal Solutions; Laird Technologies - Thermal Materials; Laird Technologies EMI; Laird Technologies IAS; Laird-Signal Integrity Products; Lantronix, Inc.; Lattice Semiconductor Corporation; Leader Tech Inc.; LED Engin Inc.; LEDdynamics Inc.; Ledil; LEM USA Inc.; LEMO; Lighting Science Group Corporation; Lime Microsystems Ltd; Linear Technology; Link Labs Inc.; Linx Technologies Inc.; Lite-On Inc.; Littelfuse Inc.; LM Technologies; LMB Heeger Inc.; LOCTITE; Logic; Logical Systems Inc.; Lumberg Automation; Lumex Opto/Components Inc.; Lumileds; Luminus Devices Inc.; Luna Optoelectronics; Luxo; 頂部

M: M/A-Com Technology Solutions; Macraigor Systems LLC; Macronix; Maestro Wireless Solutions; Mag-LED Solutions; Magnasphere Corp; Mallory Sonalert Products Inc.; Marktech Optoelectronics; Marlow Industries, Inc.; Martel Electronics; Marutsuelec Co., Ltd.; Master Appliance Co; Matrix Orbital; Maxim Integrated; Maxwell Technologies Inc.; McGraw-Hill Education; MEC Switches; Mechatronics Fan Group; MegaChips Technology America Corporation; Melexis Technologies NV; Memsic Inc.; Mentor, a Siemens Business; MeshNetics; MG Chemicals; Micrium Inc.; Micro Commercial Co; Microchip Technology; Micro-Measurements (Division of Vishay Precision Group); Micron Technology Inc.; Micronas GmbH; Microsemi Corporation; Microsemi Solutions Sdn Bhd.; Microwave Technology Inc.; Mide Technology Corporation; MikroElektronika; Mill-Max Manufacturing Corp.; MMB Networks; Modular Cable Assemblies (VA); Molex - Temp Flex; Molex Connector Corporation; Molex, LLC; Monolithic Power Systems Inc.; MPD (Memory Protection Devices); Mueller Electric Co; Multicore; Multi-Tech Systems Inc.; Murata Electronics North America; Murata Power Solutions Inc.; 頂部

N: Nakagawa Manufacturing; NDK America, Inc.; Nearson Inc.; NessCap Co Ltd; NetBurner Inc.; Newava Technology Inc.; Newhaven Display Intl; Nexperia USA Inc.; Nichicon; Nidec Copal Electronics; NimbeLink, LLC; NJR Corporation/NJRC; NKK Switches; NMB Technologies Corporation; NorComp Inc.; Nordic Semiconductor ASA; Noritake Company Inc.; Nuvoton Technology Corporation of America; NVE Corp/Isolation Products; NVE Corp/Sensor Products; NXP USA Inc.; 頂部

O: Octavo Systems LLC; Ohmite; Olimex LTD; Omron Automation and Safety; Omron Electronics Inc-EMC Div; ON Semiconductor; On Shore Technology Inc.; Onset Computer Corp; Oplink Communications, LLC; Option NV; Opto Diode Corp; Opulent Americas; Orion Fans; OSRAM Opto Semiconductors Inc.; 頂部

P: Packet Digital LLC; Panasonic - ATG; Panasonic - BSG; Panasonic - DTG; Panasonic Electric Works; Panasonic Electronic Components; Panasonic Industrial Automation Sales; Panavise; Panduit Corp; Parallax Inc.; Parlex USA LLC; Patco Electronics; Patco Services Inc; Peerless by Tymphany; Peregrine Semiconductor; Pervasive Displays; Phihong USA; Phoenix Contact; Phyton Inc.; Pimoroni Ltd; Pomona Electronics; Pontiac Coil Inc.; Portescap; Power Integrations; Powerex Inc.; PRD Plastics; Preci-Dip; Precision Design Associates, Inc; Precision Electronics Corporation; Precision Technology Inc.; Proant AB; PUI Audio, Inc.; PULS, LP; Pulsar; Pulse Electronics Network; Pulse Electronics Power; PulseLarsen Antennas; 頂部

Q: Qimonda; QT Brightek (QTB); Quadcept Inc.; Qualcomm; Qualcomm (RF360 - A Qualcomm & TDK Joint Venture); Qualtek; Quarton Inc.; Quatech-Division of B&B Electronics; Quickfilter Technologies LLC; 頂部

R: Radial Magnet Inc.; Radiocrafts AS; RAFI USA; Ramtron; Raspberry Pi; RayVio Corporation; Recom Power; Red Lion Controls; Renesas Electronics America; RF Digital Corporation; RF Solutions; RFMD; Richtek USA Inc.; Riedon; Rigado, Inc.; Rohm Semiconductor; Roman-Jones Inc.; Rose Enclosures; Rose+Krieger; RPM Systems Corp; Rubycon; RushUp; 頂部

S: Sagrad Inc.; Samsung Electro-Mechanics America, Inc.; Samsung Semiconductor, Inc.; Samtec Inc.; SanDisk; Sanken; Sanyo Denki America Inc.; SANYO Semiconductor (U.S.A) Corporation; Schaffner EMC Inc.; Schott Corporation; Schroff; Schurter Inc.; SCS; Seeed Technology Co., Ltd; Segger Microcontroller Systems; Semtech Corporation; Sensata Technologies/Airpax; Sensirion AG; Seoul Semiconductor Inc.; Serious Integrated Inc.; Serpac; SGX Sensortech; Sharp Microelectronics; Sierra Wireless; Sigma Designs Inc.; Signal Transformer; SII Semiconductor Corporation; Silego Technology; Silicon Labs; Singatron Enterprises Co Ltd; Siretta Ltd; SiTIME; Skyetek Inc; Skyworks Solutions Inc.; SL Power Electronics Manufacture of Condor/Ault Brands; SMC Corporation of America; SMC Diode Solutions; Soberton Inc.; Socle Technology Corporation; SofTec Microsystems SRL; SolidRun LTD; Souriau; SparkFun Electronics; SPEC Sensors, LLC; Spectra Symbol; Spectrum Digital Inc; Sprague-Goodman; SSI Technologies Inc; Stackpole Electronics Inc.; Staco Energy Products Company; Standex-Meder Electronics; Stanley Electric Co; Steinel America; ST-Ericsson Inc; Steute Wireless; Stewart Connector; STMicroelectronics; Storm Interface; Sullins Connector Solutions; Sumida America Components Inc.; SunLED; Sunon Fans; Susumu; SVTronics Inc.; Swanstrom Tools USA; Swissbit; Switchcraft Inc.; Synapse Wireless; 頂部

T: Tag-Connect LLC; Taitien; Taiwan Semiconductor Corporation; Taiyo Yuden; Talema Group LLC; Tallysman Wireless Inc.; Talon Communications, Inc.; Tamura; Taoglas Limited; TDK Corporation; TDK InvenSense; TDK-Lambda Americas Inc.; TE Connectivity Aerospace, Defense and Marine; TE Connectivity ALCOSWITCH Switches; TE Connectivity AMP Connectors; TE Connectivity Corcom Filters; TE Connectivity Deutsch Connectors; TE Connectivity Measurement Specialties; TE Connectivity Passive Product; TE Connectivity Potter & Brumfield Relays; TE Connectivity Raychem Cable Protection; Techflex; TechNexion; TechTools; Telcodium Inc.; Teledyne LeCroy; Telit; Tensility International Corp; Terasic Inc.; Texas Instruments; t-Global Technology; Thales Visionix, Inc.; ThingMagic, a JADAK brand; Thomas Research Products; TinyCircuits; TLG Publications; Toko America Inc.; Torex Semiconductor Ltd; Toshiba Semiconductor and Storage; Touchstone Semiconductor; TPI (Test Products Int); TPK America LLC; Transphorm; Trenz Electronic GmbH; Triad Magnetics; Trinamic Motion Control GmbH; Tripp Lite; Tronics; TRP Connector B.V.; TT Electronics/BI; TT Electronics/BI Magnetics; TT Electronics/IRC; TT Electronics/Optek Technology; TT Electronics/Welwyn; Tusonix a Subsidiary of CTS Electronic Components; Twin Industries; TXC CORPORATION; 頂部

U: UDOO; Ultra Librarian; United Chemi-Con; US Relays and Technology, Inc.; US Sensor; US-Lasers Inc.; 頂部

V: Varitronix; Vector Electronics; Verivolt LLC; VersaLogic Corporation; Vicor Corporation; Viking Technology; Virtium Technology Inc.; Vishay BC Components; Vishay Beyschlag; Vishay Dale; Vishay Electro-Films; Vishay Foil Resistors (Division of Vishay Precision Group); Vishay Huntington Electric Inc.; Vishay Semiconductor Diodes Division; Vishay Semiconductor Opto Division; Vishay Semiconductor Opto Division; Vishay Sfernice; Vishay Siliconix; Vishay Spectrol; Vishay Sprague; Vishay Thin Film; Vishay Vitramon; Visual Communications Company - VCC; Volgen America/Kaga Electronics USA; 頂部

W: Wakefield-Vette; Walsin Technology Corporation; Wandboard.Org; WeEn Semiconductors; Weidmuller; Wiha; Winbond Electronics; Winchester Electronics; Wintec Industries; WIZnet; Wurth Electronics Inc.; Wurth Electronics Midcom; Wurth Elektronik iBE; 頂部

X: Xeltek; Xilinx Inc.; XMOS; XP Power; XSens Technologies BV; 頂部

Y: Yageo; 頂部

Z: ZF Electronics; Zilog; 頂部

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